- 86-535-8888 8080
- info@credisyn.com
- No. 18 Hong Kong Middle Road, Qingdao, China
Cloth Felt Composite Copper-Clad Substrate.
Reinforced material made of glass fiber and glass mat, respectively impregnate in resin to make core material, covered with copper foil after high temperature and hot pressing. It is one of the representative products of composite substrate. This type of material has single and double-sided copper clad laminates.
Cloth Felt Composite Copper-Clad Laminates (CEM-3)
Credisyn cloth felt composite copper-clad substrates (CEM-3 series) are the industry’s most cost-effective solution for double-sided PCB manufacturing. Constructed with a non-woven glass fiber felt core sandwiched between two layers of woven E-glass fabric, they are impregnated with flame-retardant epoxy resin and clad with high-purity electrolytic copper foil. CEM-3 offers electrical and mechanical performance nearly identical to that of standard FR-4, but at a 15–25% lower material cost and with significantly better machinability—making it ideal for high-volume production of double-sided PCBs in consumer electronics, home appliances, and automotive accessories.
FR-4 Performance, 15-25% Savings
Direct drop-in replacement for standard FR-4 - 15-25% lower cost
Superior Machinability
30-40% less drill bit wear than FR-4, excellent punching capability
Double-Sided PCB Compatible
Fully supports plated through-hole (PTH) technology
Excellent Dimensional Stability
Low warpage and excellent dimensional stability for SMD assembly
Consistent Batch Quality
Ensures uniform resin distribution and consistent glass-to-resin ratio
Global Certifications
UL 94 V-0, RoHS, REACH compliant, high CTI options available
Comparison Table of Product Models and Specifications
PRODUCT GRADE
FLAMMABILITY
KEY FEATURES
BASE COLOR
FEATURE
Conventional CEM-3
Credisyn
UL 94 V-0
MILKY WHITE NATURAL YELLOW
Better drilling performance than FR-4 CTI 175V/ 600V
HIGH THERMAL CONDUCTIVITY CEM-3
Credisyn
UL 94 V-0
LIGHT GRAY
HIGH THERMAL CONDUCTIVITY CTI 600V
Common specification parameters:
- Thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 2.4mm, 3.2mm
- Copper Foil Weight: 18μm (0.5oz), 35μm (1oz), 70μm (2oz), 105μm (3oz)
- Standard Panel Sizes: 1020×1220mm, 1030×1230mm, 1040×1240mm, 1067×1220mm
- Custom Sizes: Available upon request with minimum order quantities
- Colors: Natural, white, light green, black
Main application:
- Automotive Electronics
- Industrial Control
- Consumer Electronics
- Communication & IT
- LED & New Energy
Manufacturing process:
Core Layer Preparation: Chopped glass fiber → Bonded into glass felt → Impregnation with core epoxy resin system → Drying → Cut into core prepreg sheets
Surface Layer Preparation: Electronic-grade glass cloth → Surface treatment (silane coupling agent) → Impregnation with surface epoxy resin → Drying → Cut into surface prepreg sheets
Lay-up & Pressing: Stack in the order “Copper foil → Surface glass cloth prepreg → Core glass felt prepreg(s) (single or multiple layers) → Surface glass cloth prepreg → Copper foil” → Vacuum/non-vacuum hot pressing → Cure under high temperature & pressure
Post-Processing: Unloading & cooling → Trimming/cutting to customer-specified dimensions → Inspection → Packaging & warehousing
Key process nodes: Uniformity of resin impregnation in the glass felt (to avoid resin-starved or resin-rich areas), matching of flow and gel time between core and surface prepregs (to prevent delamination or slippage), and precise design of vacuum level and pressure curve during pressing—these are the core elements ensuring blister-free, dry-patch-free, low-warpage laminates.
Detailed technical performance indicators
TEST METHOD
TEST METHOD
STANDARD CEM-3
HIGH CTI CEM-3
Standard FR-4 (for comparison)
Peel Strength (N/mm)
IPC-TM-650 2.4.8
≥1.3
≥1.3
≥1.4
Flexural Strength (MPa, LW)
IPC-TM-650 2.4.4
≥250
≥260
≥340
Tensile Strength (MPa, LW)
IPC-TM-650 2.4.1
≥300
≥310
≥410
Volume Resistivity (Ω·cm)
IPC-TM-650 2.5.17
≥10¹³
≥10¹³
≥10¹⁴
Surface Resistivity (Ω)
IPC-TM-650 2.5.17
≥10¹²
≥10¹²
≥10¹³
Dielectric Constant (1MHz)
IPC-TM-650 2.5.5.2
≤4.7
≤4.7
≤4.7
Dissipation Factor (1MHz)
IPC-TM-650 2.5.5.2
≤0.028
≤0.028
≤0.025
Glass Transition Temperature (°C)
DSC
130-135
130-135
135
Water Absorption (%)
IPC-TM-650 2.6.2.1
≤0.4
≤0.4
≤0.35
Solder Resistance (sec, 260°C)
IPC-TM-650 2.4.13
≥120
≥120
≥120
CTI (V)
IEC 60112
≥175
≥600
≥175
Punching Temperature Range (°C)
-
35-60
35-60
Not recommended
*Note: The above are generic CEM-3 typical values. High-Tg and halogen-free types may differ. Consult our shipment specification.*
WHETHER YOU NEED STANDARD PRODUCTS OR CUSTOMIZED SOLUTIONS, OUR TEAM IS READY TO SUPPORT YOU.
Head Office
- Credisyn Qingdao Industrial Technology Co.,Ltd
- No. 18 Hong Kong Middle Road, Shinan District, Qingdao City, China
- +86 535 8888 8080
- info@credisyn.com
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