- 86-535-8888 8080
- info@credisyn.com
- No. 18 Hong Kong Middle Road, Qingdao, China
R&D & Technology.
Credisyn leads in R&D & Technology for PCB substrates. Our laboratories optimize the dielectric properties and thermal resistance of our copper-clad laminate, engineering next-generation FR-4 and CEM-1 solutions for high-frequency electronics.
Driving Innovation In High-Performance CCL Materials
Innovation at Credisyn is measured by material performance. Our R&D efforts have delivered higher Tg values, lower signal loss, and halogen-free solutions that meet evolving industry standards.
Thermal Performance:
Developing resin systems with higher Tg and improved thermal resistance for lead-free assembly and high-power applications
Electrical Properties:
Formulating low Dk/Df materials that maintain signal integrity in high-frequency and high-speed digital circuits
Environmental Compliance:
Advancing halogen-free flame retardant technologies that meet UL 94 V-0 without compromising processability
Reliability Enhancement:
Improving CAF resistance and thermal cycling durability through filler optimization and interface engineering
Elite R&D Team Leading Material Technology Innovation
Our R&D team consists of seasoned chemists, material engineers and process specialists with rich electronic materials expertise. Our members have solid backgrounds from top laminate manufacturers and research institutes, driving both iterative product upgrades and long-term technological innovation.
- Resin formulation specialists
- Lamination process engineers
- Material characterization analysts
- Application support engineers
Advanced R&D Lab: Full-Range CCL Testing Capabilities
Our in-house laboratory is equipped for comprehensive material characterization and reliability testing. Equipment capabilities cover the full range of IPC-TM-650 test methods required for CCL qualification.
Key Equipment & Capabilities:
- Thermal Analysis: DSC, TGA, TMA for Tg, CTE, and decomposition temperature measurement
- Electrical Testing: Precision LCR meters for Dk/Df characterization across frequency ranges
- Mechanical Testing: Universal testing machines for peel strength and flexural modulus
- Reliability Testing: Thermal cycling chambers, solder float baths (288°C), and pressure cooker test equipment
- Analytical Instruments: FTIR for resin identification, SEM for filler distribution analysis
Our technology portfolio addresses key performance requirements in PCB fabrication and end-use applications.
High-Tg FR-4 Formulations
Resin systems delivering Tg 170-180°C with reliable thermal stability
Halogen-Free Technology
Phosphorus-nitrogen flame retardant systems meeting UL 94 V-0 requirements
Low Dk/Df Materials
Controlled dielectric properties for high-frequency and high-speed applications
CAF Resistance
Formulations and filler technologies that enhance resistance to conductive anodic filament formation
Lead-Free Compatibility
Materials engineered to withstand higher processing temperatures without delamination
High-Frequency Low-Loss
Optimized resin & glass cloth ensure ultra-low Dk/Df for high-speed 5G signals.
TELL US YOUR PROJECT REQUIREMENTS, OUR R&D TEAM WILL PROVIDE EXCLUSIVE SOLUTIONS.
Head Office
- Credisyn Qingdao Industrial Technology Co.,Ltd
- No. 18 Hong Kong Middle Road, Shinan District, Qingdao City, China
- +86 535 8888 8080
- info@credisyn.com
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