- 86-535-8888 8080
- info@credisyn.com
- No. 18 Hong Kong Middle Road, Qingdao, China
Standard System.
Credisyn operates under a rigorous Standard System to guarantee material consistency. Our copper-clad laminate, FR-4, and CEM-1 manufacturing processes strictly comply with global regulations, delivering defect-free substrates for PCB electronics.
Compliant With Global Industry Standards
Product standards & specifications compliant with global industry standards: IPC-4101, UL 94 V-0, RoHS, REACH, IATF 16949. Access FR-4 and CEM-1 CCL technical datasheets including Dk, Df, Tg, and thermal conductivity for confident PCB material selection.
Key Points Of Application For Testing Standards
Priority should be given to using the GB/T series standards for domestic trade in China
The international market is mainly based on IPC-4101E and IEC 61249-2 series standards
High frequency copper-clad laminates require additional reference to GB/T 43801-2024 and IPC-4101 high-frequency material specifications
Special substrates (metal based, flexible, ceramic based) require corresponding special standards
International core applicable standards
- IPC-4562 Metal Foil for Printed Wiring Boards
- JIS C 6481 Test method manual
- JIS C 6485 Evaluation Reference
- IPC-4101 D Specification for base materials for rigid and multi-layer printed boards
- IPC-TM-650 Test method manual
- IPC-4412 Specification for finished fabric woven“E”glass for printed boards
- UL-94 Test for Flammability of plastic materials for parts in Devices and Appliances.
Chinese core applicable standards
- GB/T 4721-2021 General rules for rigid copper-clad laminates for printed circuits
- GB/T 4722-2022 Test method for rigid copper-clad laminates for printed circuits
- GB/T 4724-2017 Copper Clad Composite Base Plate for Printed Circuits
- GB/T 4725-2022 Copper Clad Epoxy Fiberglass Cloth Laminated Plates for Printed Circuits
- GB/T 43801-2024 Test method for relative dielectric constant and loss tangent of copper-clad laminates in microwave frequency band
- GB/T 13557 Flexible Copper Foil Materials for Printed Circuits
- GB/T 14598.99 Metal based copper-clad laminates for printed boards
Product Technical Standards
Industry-aligned specifications for every CCL application scenario
FR-4 CCL Standards
Rigorous control of Tg, CTE, copper peel strength, and UL 94 V-0 flame rating for reliable multilayer PCB fabrication and assembly.
- Tg (Glass Transition): 130°C / 140°C / 170°C options
- Td (Decomposition): ≥ 310°C
- T260 / T288: ≥ 30 min / ≥ 5 min
- CTE (Z-axis): ≤ 50 ppm/°C
- Copper Peel Strength: ≥ 1.05 N/mm
- Flexural Strength: ≥ 350 MPa (lengthwise)
- Flammability: UL 94 V-0
- Dielectric Breakdown: ≥ 40 kV
Metal-Base CCL Standards
High thermal conductivity, superior dielectric strength, and aging resistance for LED and power electronics.
- Thermal Conductivity: 1.0 / 1.5 / 2.0 / 3.0 W/m·K
- Dielectric Layer Thickness: 35 – 150 µm
- Dielectric Strength (AC/DC): ≥ 3 kV AC / ≥ 4 kV DC
- Volume Resistivity: ≥ 10¹² Ω·cm
- Surface Resistivity: ≥ 10¹¹ Ω
- Thermal Cycling Aging: 1000h @ 125°C
- Peel Strength (After Aging): ≥ 0.7 N/mm
- Operating Temp Range: -40°C to +150°C
High-frequency CCL Standards
Precision Dk/Df control, impedance matching, and signal integrity for 5G, radar, and high-speed digital.
- Dk (10 GHz): 2.2 – 10.2 ±0.05
- Df (Dissipation Factor): 0.0008 – 0.004 @10 GHz
- Impedance Tolerance: ±5% to ±8%
- Insertion Loss: ≤ 0.5 dB/cm @10 GHz
- Phase Stability (Temp): ≤ ±3°
- TCDk (Thermal Coefficient): ≤ ±50 ppm/°C
- Moisture Absorption: ≤ 0.1%
- Surface Roughness (Rz): ≤ 2 µm
- Thermal Conductivity 0.3 – 0.8 W/m·K
Application-Specific Standards
Automotive Electronics
Rigorous quality management and component qualification for automotive-grade reliability and zero-defect manufacturing.
- Tg (Glass Transition): 130°C / 140°C / 170°C options
- Td (Decomposition): ≥ 310°C
- T260 / T288: ≥ 30 min / ≥ 5 min
- CTE (Z-axis): ≤ 50 ppm/°C
- Copper Peel Strength: ≥ 1.05 N/mm
- Flexural Strength: ≥ 350 MPa (lengthwise)
- Flammability: UL 94 V-0
- Dielectric Breakdown: ≥ 40 kV
- Volume Resistivity ≥ 10¹² Ω·cm
5G Telecommunications
High-frequency material testing and laminate specifications for low signal loss and high-speed data integrity.
- Thermal Conductivity: 1.0 / 1.5 / 2.0 / 3.0 W/m·K
- Dielectric Layer Thickness: 35 – 150 µm
- Dielectric Strength (AC/DC): ≥ 3 kV AC / ≥ 4 kV DC
- Volume Resistivity: ≥ 10¹² Ω·cm
- Surface Resistivity: ≥ 10¹¹ Ω
- Thermal Cycling Aging: 1000h @ 125°C
- Peel Strength (After Aging): ≥ 0.7 N/mm
- Operating Temp Range: -40°C to +150°C
Industrial Control
Safety and performance standards for PCBs in harsh environments: flame retardancy, creepage, thermal endurance.
- Dk (10 GHz): 2.2 – 10.2 ±0.05
- Df (Dissipation Factor): 0.0008 – 0.004 @10 GHz
- Impedance Tolerance: ±5% to ±8%
- Insertion Loss: ≤ 0.5 dB/cm @10 GHz
- Phase Stability (Temp): ≤ ±3°
- TCDk (Thermal Coefficient): ≤ ±50 ppm/°C
- Moisture Absorption: ≤ 0.1%
- Surface Roughness (Rz): ≤ 2 µm
- Thermal Conductivity 0.3 – 0.8 W/m·K
Medical Equipment
Quality management for medical device manufacturing and highest flame retardancy for patient-safe electronics.
- Dk (10 GHz): 2.2 – 10.2 ±0.05
- Df (Dissipation Factor): 0.0008 – 0.004 @10 GHz
- Impedance Tolerance: ±5% to ±8%
- Insertion Loss: ≤ 0.5 dB/cm @10 GHz
- Phase Stability (Temp): ≤ ±3°
- TCDk (Thermal Coefficient): ≤ ±50 ppm/°C
- Moisture Absorption: ≤ 0.1%
- Surface Roughness (Rz): ≤ 2 µm
- Thermal Conductivity 0.3 – 0.8 W/m·K
DOWNLOAD OUR PRODUCT STANDARD DOCUMENTS OR CONSULT ABOUT COMPLIANCE REQUIREMENTS.
Head Office
- Credisyn Qingdao Industrial Technology Co.,Ltd
- No. 18 Hong Kong Middle Road, Shinan District, Qingdao City, China
- +86 535 8888 8080
- info@credisyn.com
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