• 86-535-8888 8080
  • info@credisyn.com
  • No. 18 Hong Kong Middle Road, Qingdao, China

Glass Cloth Copper Clad Substrate.

Reinforced material made of glass fiber cloth, impregnated in epoxy resin to make core material, covered with copper foil after high temperature and hot pressing. It is the most widely used and representative product of rigid copper clad laminates. This type of material includes single-sided, double-sided and can be used for multi-layer copper clad laminates.

Glass Cloth Copper-Clad Laminates (FR-4 Series)

Credisyn glass cloth copper-clad substrates (also known as epoxy glass CCL) are the industry gold standard for high-performance printed circuit board manufacturing. Constructed from high-quality E-glass fiber cloth impregnated with flame-retardant epoxy resin and bonded with ultra-pure electrolytic copper foil, our comprehensive FR-4 product line delivers exceptional mechanical strength, superior thermal stability, and consistent electrical insulation. Ideal for double-sided and multi-layer PCBs used in 5G communications, automotive electronics, industrial automation, and medical devices.

Industry Standard Reliability

Proven performance in billions of electronic devices worldwide

Comprehensive Tg Range

Standard (135°C) to ultra-high Tg (180°C) options for all applications

Excellent Dimensional Stability

Low CTE minimizes warpage during PCB assembly

Superior Electrical Properties

Low dielectric loss for high-frequency applications

Global Automotive Certification

IATF 16949 certified for automotive electronics

Full Customization

Various thicknesses, copper weights, panel sizes, and special grades

Comparison Table of Product Models and Specifications

PRODUCT GRADE

FLAMMABILITY

KEY FEATURES

BASE COLOR

FEATURE

Conventional CEM-3
UL 94 V-0
V0
MILKY WHITE NATURAL YELLOW
Better drilling performance than FR-4 CTI 175V/ 600V
HIGH THERMAL CONDUCTIVITY CEM-3
Credisyn
V0
LIGHT GRAY
HIGH THERMAL CONDUCTIVITY CTI 600V

Common specification parameters:

  • Thickness: 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 2.4mm, 3.2mm
  • Copper Foil Weight: 12μm (0.3oz), 18μm (0.5oz), 35μm (1oz), 70μm (2oz), 105μm (3oz), 140μm (4oz), 210μm (6oz), 280μm (8oz)
  • Standard Panel Sizes: 1020×1220mm, 1030×1230mm, 1040×1240mm, 1067×1220mm, 1092×1245mm
  • Custom Sizes: Available upon request with minimum order quantities

Main application:

  • 5G base station RF boards and power amplifiers
  • Router and switch motherboards
  • Fiber optic transceivers and communication modules
  • Satellite communication equipment

Manufacturing process

Electronic-grade glass cloth → Surface treatment (silane coupling agent) → Resin impregnation (with curing agent, fillers, flame retardants, etc.) → Prepreg (oven solvent removal / partial curing, wound into B-stage rolls) → Lay-up (copper foil and prepregs combined per required thickness and copper weight) → Vacuum / non-vacuum hot pressing → Unloading & cooling → Trimming / cutting → Inspection → Packaging & warehousing
 
Key process nodes: control of wettability between glass cloth and resin, precise control of prepreg resin flow and gel time, and the design of lamination temperature/pressure/vacuum profiles, which determine the final board’s thickness uniformity, dielectric properties, and reliability.

Detailed technical performance indicators

TEST METHOD

TEST METHOD

STANDARD FR-4

HIGH TG FR-4 (170°C)

ULTRA-HIGH TG FR-4 (180°C)

Peel Strength (N/mm)
IPC-TM-650 2.4.8
≥1.4
≥1.6
≥1.7
Flexural Strength (MPa, LW)
IPC-TM-650 2.4.4
≥340
≥420
≥450
Tensile Strength (MPa, LW)
IPC-TM-650 2.4.1
≥410
≥490
Item Text≥520
Volume Resistivity (Ω·cm)
IPC-TM-650 2.5.17
≥10¹⁴
≥10¹⁴
≥10¹⁴
Surface Resistivity (Ω)
IPC-TM-650 2.5.17
≥10¹³
≥10¹³
≥10¹³
Dielectric Constant (1MHz)
IPC-TM-650 2.5.5.2
≤4.7
≤4.5
≤4.4
Dissipation Factor (1MHz)
IPC-TM-650 2.5.5.2
≤0.025
≤0.020
≤0.018
Glass Transition Temperature (°C)
DSC
135
175
185
Water Absorption (%)
IPC-TM-650 2.6.2.1
≤0.35
≤0.25
≤0.20
Thermal Conductivity (W/m·K)
IPC-TM-650 2.5.13
0.35
0.42
0.45
CTE (ppm/°C, X-Y axis)
IPC-TM-650 2.4.24
13-17
11-15
10-14
CTE (ppm/°C, Z-axis)
IPC-TM-650 2.4.24
50-70
30-50
25-40
Solder Resistance (sec, 260°C)
IPC-TM-650 2.4.13
≥120
≥180
≥240

Note: These are general reference values; specific values vary by product designation and resin system. Consult our shipment specification.

WHETHER YOU NEED STANDARD PRODUCTS OR CUSTOMIZED SOLUTIONS, OUR TEAM IS READY TO SUPPORT YOU.

CONTACT OUR TEAM

Credisyn: high-end copper-clad laminates for high-frequency, high-speed & ultra-thin. Trusted in automotive, aerospace & electronics.

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Head Office
  • Credisyn Qingdao Industrial Technology Co.,Ltd
  • No. 18 Hong Kong Middle Road, Shinan District, Qingdao City, China
  • +86 535 8888 8080
  • info@credisyn.com
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