- 86-535-8888 8080
- info@credisyn.com
- No. 18 Hong Kong Middle Road, Qingdao, China
Cloth Paper Composite Copper-Clad Substrate.
Reinforced material made of glass fiber and bleached kraft paper, respectively impregnate in resin to make core material, covered with copper foil after high temperature and hot pressing. It is one of the representative products of composite substrate. Such material are generally single-sided copper clad laminates.
Cloth Paper Composite Copper-Clad Laminates (CEM-1)
Credisyn cloth paper composite copper-clad substrates (CEM series) are the industry’s most cost-effective solution for single-sided and simple double-sided PCB manufacturing. CEM-1 features a cellulose paper core with glass fiber cloth faces, while CEM-3 uses a glass fiber mat core with glass fiber cloth faces. Both offer superior mechanical strength, better thermal stability, and improved electrical performance compared to paper-based FR-1, at a significantly lower cost than full glass cloth FR-4. Ideal for high-volume production of home appliances, consumer electronics, and automotive accessories.
Unbeatable Cost-Performance
15-40% cheaper than standard FR-4, better performance than FR-1
Superior Machinability
Excellent punching capability, 30-40% less drill bit wear than FR-4
FR-4 Compatible Processing
Uses the same PCB manufacturing equipment as FR-4
Improved Mechanical Strength
Higher rigidity and dimensional stability than paper-based CCL
Excellent Heat Resistance
Better solder resistance and thermal stability than FR-1
Global Certifications
UL 94 V-0, RoHS, REACH compliant, high CTI options available
Comparison Table of Product Models and Specifications
PRODUCT GRADE
MODEL
FLAMMABILITY
BASE COLOR
FEATURE
22F（GB）
Credisyn
UL 94 V-0
YELLOW
Excellent punching property
CONVENTIONAL CEM-1
Credisyn
UL 94 V-0
YELLOW WHITE
EXCELLENT PUNCHING PROPERTY CTI 175V/ 300V/ 600V
CONVENTIONAL CEM-1
Crdisyn
UL 94 V-0
YELLOW WHITE
EXCELLENT MOISTURE AND THERMAL RESISTANCE CTI 300V
CONVENTIONAL CEM-1
Crediysn
UL 94 V-0
YELLO WHITE
EXCELLENT PUNCHING PROPERTY CTI 175V/ 300V/ 600V
HALOGEN-FREE CEM-1
Crediysn
UL 94 V-0
NATURAL
HALOGEN FREE CTI 175V
HALOGEN-FREE CEM-1
Credisyn
UL 94 V-0
NATURAL
HALOGEN FREE CTI 600V
Common specification parameters:
- Thickness: 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 2.4mm
- Copper Foil Weight: 18μm (0.5oz), 35μm (1oz), 70μm (2oz)
- Standard Panel Sizes: 1020×1220mm, 1030×1230mm, 1040×1240mm
- Custom Sizes: Available upon request
- Colors: Natural, white, light green (CEM-3 only)
Main application
- White Goods & Smart Home
- Automotive Electronics
- Industrial & Power
- LED Lighting
- Electronic toys, fitness equipment control, etc
Manufacturing process
Core Layer Preparation: Wood pulp paper → Impregnation with core resin (epoxy or phenolic system) → Drying → Cutting into core prepreg sheets
Surface Layer Preparation: Electronic-grade glass cloth → Surface treatment → Impregnation with surface resin (usually compatible with core resin) → Drying → Cutting into surface prepreg sheets
Lay-up & Pressing: Stack in the order “Copper foil → Surface prepreg (glass cloth base) → Core prepreg(s) (paper base) → Surface prepreg (glass cloth base) → Copper foil” → Load into press → Vacuum/non-vacuum high temperature & pressure → Cure & mold
Post-Processing: Unloading & cooling → Trimming/cutting → Inspection → Packaging & warehousing
Key process nodes: Matching the resin flow of the core and surface layers (to prevent slipping or resin-starved areas during pressing), resin absorption balance between glass cloth and paper, and the precise design of the pressing temperature/pressure curve, which directly determine interlayer bonding strength and warpage levels.
Detailed technical performance indicators
TEST METHOD
TEST METHOD
CEM-1
CEM-3
Standard FR-4 (for comparison)
Peel Strength (N/mm)
IPC-TM-650 2.4.8
≥1.2
≥1.3
≥1.4
Flexural Strength (MPa, LW)
IPC-TM-650 2.4.4
≥180
≥250
≥340
Volume Resistivity (Ω·cm)
IPC-TM-650 2.5.17
≥10¹³
≥10¹³
≥10¹⁴
Surface Resistivity (Ω)
IPC-TM-650 2.5.17
≥10¹²
≥10¹²
≥10¹³
Dielectric Constant (1MHz)
IPC-TM-650 2.5.5.2
≤4.8
≤4.7
≤4.7
Dissipation Factor (1MHz)
IPC-TM-650 2.5.5.2
≤0.030
≤0.028
≤0.025
Glass Transition Temperature (°C)
DSC
120
130
135
Water Absorption (%)
IPC-TM-650 2.6.2.1
≤0.5
≤0.4
≤0.35
Solder Resistance (sec, 260°C)
IPC-TM-650 2.4.13
≥90
≥120
≥120
CTI (V)
IEC 60112
175-300
175-600
175-600
Punching Temperature Range (°C)
-
45-70
35-60
Not recommended
*Note: The above are generic CEM-1 typical values. Specific data subject to our shipment specification for the corresponding grade.*
WHETHER YOU NEED STANDARD PRODUCTS OR CUSTOMIZED SOLUTIONS, OUR TEAM IS READY TO SUPPORT YOU.
Head Office
- Credisyn Qingdao Industrial Technology Co.,Ltd
- No. 18 Hong Kong Middle Road, Shinan District, Qingdao City, China
- +86 535 8888 8080
- info@credisyn.com
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