• 86-535-8888 8080
  • info@credisyn.com
  • No. 18 Hong Kong Middle Road, Qingdao, China

Paper Core Copper Clad Substrate.

Reinforced material made of bleached kraft paper, respectively impregnate in resin to make core material, covered with copper foil after high temperature and hot pressing. This type of material is generally single-sided copper clad laminate.

Paper Core Copper-Clad Laminates (FR-1/XPC)

Credisyn paper core copper-clad substrates (also known as phenolic paper CCL) are the most cost-effective solution for single-sided PCB manufacturing. Made from high-quality cellulose paper impregnated with modified phenolic resin and bonded with electrolytic copper foil, our FR-1 and XPC series offer excellent machinability, consistent electrical performance, and reliable flame retardancy. Ideal for high-volume production of consumer electronics, home appliances, and lighting products.

Lowest Cost in Industry

30-50% cheaper than FR-4 fiberglass laminates

Superior Machinability

Easy to punch, drill, and V-cut, reducing PCB processing time

Consistent Quality

Strict process control ensures batch-to-batch uniformity

Global Certifications

UL 94 V-0/V-1, RoHS, REACH compliant

Fast Delivery

7-10 days for standard orders, 3-5 days for urgent orders

Customization Available

Various thicknesses, copper foil weights, and panel sizes

Comparison Table of Product Models and Specifications

PRODUCT GRADE

FLAMMABILITY

KEY FEATURES

BASE COLOR

FEATURE

Conventional CEM-3
UL 94 V-0
V0
MILKY WHITE NATURAL YELLOW
Better drilling performance than FR-4 CTI 175V/ 600V
HIGH THERMAL CONDUCTIVITY CEM-3
Credisyn
V0
LIGHT GRAY
HIGH THERMAL CONDUCTIVITY CTI 600V

Common specification parameters:

  • Thickness: 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm
  • Copper Foil Weight: 18μm (0.5oz), 35μm (1oz), 70μm (2oz)
  • Standard Panel Size: 1020mm × 1220mm, 1030mm × 1230mm
  • Custom Sizes: Available upon request

Main application:

  • Consumer Electronics
  • LED Lighting
  • Power Adapters
  • Automotive Electronics

Manufacturing process

Kraft paper / wood pulp paper → Resin impregnation (with flame retardants, curing agents) → Prepreg (drying, winding) → Lay-up (combining prepreg with copper foil) → Hot pressing (high temperature & pressure) → Unloading & cooling → Trimming / cutting → Inspection → Packaging & warehousing
 
Key process nodes: formulation of resin mixture, uniformity of impregnation, control of temperature and pressure curves during pressing.

Detailed technical performance indicators

TEST METHOD

TEST METHOD

XPC

FR-1

FR-2

Peel Strength (N/mm)
IPC-TM-650 2.4.8
≥1.0
≥1.2
≥1.3
Flexural Strength (MPa)
IPC-TM-650 2.4.4
≥80
≥90
≥100
Volume Resistivity (Ω·cm)
IPC-TM-650 2.5.17
≥10¹²
≥10¹³
≥10¹³
Surface Resistivity (Ω)
IPC-TM-650 2.5.17
≥10¹¹
≥10¹²
≥10¹²
Dielectric Constant (1MHz)
IPC-TM-650 2.5.5.2
≤4.8
≤4.7
≤4.6
Dissipation Factor (1MHz)
IPC-TM-650 2.5.5.2
≤0.035
≤0.030
≤0.028
Glass Transition Temperature (°C)
DSC
105
115
125
Water Absorption (%)
IPC-TM-650 2.6.2.1
≤0.8
≤0.7
≤0.6

Note: The above data are typical values for engineering reference, not absolute batch acceptance criteria.

WHETHER YOU NEED STANDARD PRODUCTS OR CUSTOMIZED SOLUTIONS, OUR TEAM IS READY TO SUPPORT YOU.

CONTACT OUR TEAM

Credisyn: high-end copper-clad laminates for high-frequency, high-speed & ultra-thin. Trusted in automotive, aerospace & electronics.

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Head Office
  • Credisyn Qingdao Industrial Technology Co.,Ltd
  • No. 18 Hong Kong Middle Road, Shinan District, Qingdao City, China
  • +86 535 8888 8080
  • info@credisyn.com
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